External Visual Inspection

Appearance test refers to confirming the number of chips received，inner packaging，Humidity indicator，Desiccant requirements and appropriate outer packaging。Second, the appearance inspection of a single chip，mainly include：Chip typing，years， Country of origin，Whether to recoat，Pin status，Are there any re-sand marks，Unknown residue，factorylogos position

X-Ray

X-rayTesting is a real-time non-destructive analysis to check the hardware components inside the component，Mainly check the lead frame of the chip，Wafer size，Gold wire binding diagram，ESDDamage and holes， Customers can provide usable samples or previous purchases for comparison check。

Electrical and Temperature Testing

We provide extensive chip functional tests，From basic parameters to basisMilSTD883Confirm chip function，Especially complex chips such asFPGA, CPLD and PLA。

Decapsulation

Open the lid（Unblock）Mainly use the instrument to corrode the package on the chip surface，Check for wafers inside，Wafer size，Manufacturer's logo，Copyright year，Wafer code，Can determine the authenticity of the chip。